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Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test

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4 Author(s)
Tong Hong Wang ; Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung ; Chang-Chi Lee ; Yi-Shao Lai ; Yu-Cheng Lin

Author(s)

Tong Hong Wang
Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung
Chang-Chi Lee ; Yi-Shao Lai ; Yu-Cheng Lin