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Thermal-mechanical Modelling of Power Electronic Module Packaging

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4 Author(s)
Hua Lu ; School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10 9LS, UK. Email: h.lu@gre.ac.uk ; Tim Tilford ; Xiangdong Xue ; Chris Bailey

Author(s)

Hua Lu
School of Computing and Mathematical Sciences, University of Greenwich, 30 Park Row, London SE10 9LS, UK. Email: h.lu@gre.ac.uk
Tim Tilford ; Xiangdong Xue ; Chris Bailey