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Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications

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3 Author(s)
Seok, S. ; IEMN/IRCICA CNRS, Villeneuve d''Ascq, France ; Rolland, N. ; Rolland, P.A.

Author(s)

Seok, S.
IEMN/IRCICA CNRS, Villeneuve d''Ascq, France
Rolland, N. ; Rolland, P.A.