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Thermo-mechanical Reliability Study of High I/Os Flip Chip On Laminated Substrate Based on FEA, RSM and Interfacial Fracture Mechanics

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5 Author(s)
Yingjun Cheng ; Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai ; Gaowei Xu ; Dapeng Zhu ; Xiaoqin Lin
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Author(s)

Yingjun Cheng
Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai
Gaowei Xu ; Dapeng Zhu ; Xiaoqin Lin ; Le Luo