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A wafer-level microcap array to enable high-yield microsystem packaging

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3 Author(s)
Chiang, Y.-M.J. ; Appl. MEMS Inc., Stafford, TX, USA ; Bachman, M. ; Li, G.P.

Author(s)

Chiang, Y.-M.J.
Appl. MEMS Inc., Stafford, TX, USA
Bachman, M. ; Li, G.P.