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Characteristics and reliability of fast-flow, snap-cure, and reworkable underfills for solder bumped flip chip on low-cost substrates

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2 Author(s)
J. H. Lau ; Agilent Technol. Inc., Santa Clara, CA, USA ; C. Chang


J. H. Lau
Agilent Technol. Inc., Santa Clara, CA, USA
C. Chang