By Topic

Electronics Packaging Manufacturing, IEEE Transactions on

Aims & Scope

This journal addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=6104 More »

Frequency: 2

Subjects

  • Components, Circuits, Devices & Systems
  • Power, Energy, & Industry Applications

Contacts

Editor-in-Chief
R. Wayne Johnson
Auburn University
162 Broun Hall
Auburn, AL  36849  36849  USA
johnson@eng.auburn.edu
Phone:+1 334 844 1880
Fax:+1 334 844 1898

About this Journal

Sponsor

Contacts

Editor-in-Chief
R. Wayne Johnson
Auburn University