IEEE Transactions on Components, Packaging and Manufacturing Technology

Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=5503870 More »

Frequency: 12

ISSN: 2156-3950

Contacts

Co-Editor
Jose E Schutt-Aíne
Electrical Performance of Integrated Systems
University of Illinois at Urban Champaign
Electrical and Computer Engineering
155 Everitt Laboratory, 1406 W. Green St.
Urbana, IL  61801  USA
jschutt@emlab.uiuc.edu
Phone: +1 217 244 7279

Co-Editor
Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX  78735  USA
rama@ieee.org

Co-Editor
Kuo-Ning Chiang
Advanced Packaging Technologies
National Tsing Hua University
Department of Power Mechanical Engineering
No.101, Sec.2, Kuang Fu Road
Hsinchu  300  Taiwan
knchiang@pme.nthu.edu.tw
Phone: 886 3 5742925

Co-Editor
Muhannad Bakir
Electronics Manufacturing
School of Electrical and Computer Engineering
Georgia Tech
Atlanta, GA 30332 USA
mbakir@ece.gatech.edu
Phone: +1 404 385 6276

Managing Editor
Ravi Mahajan
Intel
5000 W. Chandler Blvd.
Chandler, AZ 85226  USA
ravi.v.mahajan@intel.com
Phone: +1 480 554 3715