Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging was published 1994-1998. The latest title for this publication is IEEE Transactions on Advanced Packaging.
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4. Highly efficient coupling between single-mode fiber and polymer optical waveguides
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PDF (112 KB)
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5. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
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PDF (364 KB)
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7. Interconnect and circuit modeling techniques for full-chip power supply noise analysis
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PDF (332 KB)
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8. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
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11. Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs
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PDF (600 KB)
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12. Design and qualification of hermetically packaged lithium niobate optical modulator
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PDF (96 KB)
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13. Controlled solder interdiffusion for high power semiconductor laser diode die bonding
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PDF (512 KB)
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15. The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
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PDF (188 KB)
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17. Electrical characterization of the interconnected mesh power system (IMPS) MCM topology
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19. Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging
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PDF (552 KB)
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21. Interconnect propagation delay modeling and validation for the 16-MB CMOS SRAM chip
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22. Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder joints
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23. Predicting delamination in plastic IC packages and determining suitable mold compound properties
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24. Surface mount technology-a study of safety considerations: silver migration and adhesive flammability
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Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging was published 1994-1998. The latest title for this publication is IEEE Transactions on Advanced Packaging.
Further Links
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging was published 1994-1998. The latest title for this publication is IEEE Transactions on Advanced Packaging.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=96 More »
Frequency: 4
ISSN:
1070-9894
Subjects
- Components, Circuits, Devices & Systems
- Power, Energy, & Industry Applications
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Title History
- ( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
- ( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
- ( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
- ( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
- ( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
- ( 1963 - 1965 ) Component Parts, IEEE Transactions on
- ( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
- ( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
- ( 1955 - 1962 ) Component Parts, IRE Transactions on
- ( 1956 - 1959 ) Production Techniques, IRE Transactions on
- ( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on
