Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Latest Published Articles
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Evaporation cooling of high power electronic devices
Aug-06 2002 -
Minimizing the computational cost and memory requirements for the capacitance calculation of 3-D multiconductor systems
Aug-06 2002 -
Analysis of TAB inner lead fatigue in thermal cycle environments
Aug-06 2002 -
Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip
Aug-06 2002 -
Techniques for measuring energy consumption of reprographic devices
Aug-06 2002
Popular Articles
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Artificial neural networks in manufacturing: concepts, applications, and perspectives
Aug-06 2002 -
Physical and chemical properties of metal oxide additions to Ag-SnO 2 contact materials and predictions of electrical performance
Aug-06 2002 -
Optimization of copper wire bonding on Al-Cu metallization
Aug-06 2002 -
Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling
Aug-06 2002 -
An overview of high-temperature electronic device technologies and potential applications
Aug-06 2002
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Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.-
1. Artificial neural networks in manufacturing: concepts, applications, and perspectives
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PDF (1876 KB)
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2. Physical and chemical properties of metal oxide additions to Ag-SnO 2 contact materials and predictions of electrical performance
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PDF (544 KB)
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4. Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling
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PDF (480 KB)
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5. An overview of high-temperature electronic device technologies and potential applications
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PDF (1560 KB)
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7. Analysis of thermal transient data with synthesized dynamic models for semiconductor devices
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PDF (676 KB)
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9. Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current
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PDF (648 KB)
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13. Modeling the properties of PECVD silicon dioxide films using optimized back-propagation neural networks
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PDF (840 KB)
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15. Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art
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PDF (420 KB)
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16. A practical excimer laser-based cleaning tool for removal of surface contaminants
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PDF (1484 KB)
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18. A dielectric surface coating technique to enhance boiling heat transfer from high power microelectronics
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PDF (792 KB)
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19. Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
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PDF (708 KB)
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20. Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives
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PDF (248 KB)
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22. Reliability assessment of electronic components exposed to long-term non-operating conditions
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PDF (260 KB)
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23. Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading
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PDF (196 KB)
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25. High performance forced air cooling scheme employing microchannel heat exchangers
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PDF (1244 KB)
Aims & Scope
Further Links
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=95 More »
Frequency: 4
ISSN:
1070-9886
Subjects
- Components, Circuits, Devices & Systems
- Power, Energy, & Industry Applications
Author Resources
Title History
- ( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
- ( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
- ( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
- ( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
- ( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
- ( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
- ( 1963 - 1965 ) Component Parts, IEEE Transactions on
- ( 1955 - 1962 ) Component Parts, IRE Transactions on
- ( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
- ( 1956 - 1959 ) Production Techniques, IRE Transactions on
- ( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on
