Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
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IEEE Transactions on Very Large Scale Integration (VLSI) Systems includes all major aspects of the design and implementation of VLSI/ULSI and microelectronic systems.
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Meet Our Editors
Editor-in-Chief
Yehea Ismail
CND Director
American University of Cairo and Zewail City of Science and Technology
New Cairo, Egypt
tvlsieic@eecs.northwestern.edu
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Neural Networks and Learning Systems, IEEE Transactions on
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Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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10. Effective and Efficient Approach for Power Reduction by Using Multi-Bit Flip-Flops
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12. Theoretical Modeling of Elliptic Curve Scalar Multiplier on LUT-Based FPGAs for Area and Speed
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19. Novel MIMO Detection Algorithm for High-Order Constellations in the Complex Domain
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21. Current-Comparison-Based Domino: New Low-Leakage High-Speed Domino Circuit for Wide Fan-In Gates
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22. Architecture and Design Flow for a Highly Efficient Structured ASIC
Man-Ho Ho ; Yan-Qing Ai ; Chau, T.C.-P. ; Yuen, S.C.L. ; Chiu-Sing Choy ; Leong, P.H.W. ; Kong-Pang Pun |
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Aims & Scope
IEEE Transactions on Very Large Scale Integration (VLSI) Systems includes all major aspects of the design and implementation of VLSI/ULSI and microelectronic systems.
Meet Our Editors
Editor-in-Chief
Yehea Ismail
CND Director
American University of Cairo and Zewail City of Science and Technology
New Cairo, Egypt
tvlsieic@eecs.northwestern.edu
Further Links
Aims & Scope
Includes all major aspects of the design and implementation of VLSI/ULSI and microelectronic systems. Topics of special interest include: systems specifications, design and partitioning, high performance computing and communication systems, neural networks, wafer-scale integration and multichip module systems and their applications.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=92 More »
Frequency: 12
ISSN: 1063-8210
Publication Details: IEEE Transactions on Very Large Scale Integration Systems
Subjects
- Components, Circuits, Devices & Systems
Contacts
Editor-in-Chief
Yehea Ismail
CND Director
American University of Cairo and Zewail City of Science and Technology
New Cairo, Egypt
tvlsieic@eecs.northwestern.edu
Associate Editor-in-Chief
Massimo Alioto
University of Siena
Siena, 53100 Italy
malioto@dii.unisi.it
About this Journal
Editorial Board
Content Announcements
Author Resources
Society Sponsor
Contacts
Editor-in-Chief
Yehea Ismail
CND Director
American University of Cairo and Zewail City of Science and Technology
New Cairo, Egypt
tvlsieic@eecs.northwestern.edu
