Parts, Hybrids, and Packaging, IEEE Transactions on
IEEE Transactions on Parts, Hybrids, and Packaging was published 1971-1977. The latest title for this publication is IEEE Transactions on Advanced Packaging.
Latest Published Articles
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Arc Termination Current on Breaking Contacts
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An Aluminum Solid Electrolytic Capacitor with an Organic Semiconductor Electrolyte
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An Approach for Evaluating Epoxy Adhesives for Use in Hybrid Microelectronic Assembly
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Reactively Bonded Thin-Film Conductors, a New Component for Combination Thin- and Thick-Film Technology
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Aluminum Interconnections and Beam Leads on Polymide-Coated Copper Substrates
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Design of Planar Rectangular Microelectronic Inductors
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UV/Ozone Cleaning of Surfaces
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Statistical Interpretation of Meniscograph Solderability Tests
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The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics
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Free Convection Heat Transfer from Vertical Fin-Arrays
Jan-06 2003
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Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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4. The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics
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PDF (1560 KB)
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8. The High Temperature Deformation Properties of Gold and Thermocompression Bonding
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PDF (1112 KB)
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12. Wiggly Phase Shifters and Directional Couplers for Radio-Frequency Hybrid-Microcircuit Applications
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PDF (872 KB)
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20. Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach
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PDF (896 KB)
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Aims & Scope
IEEE Transactions on Parts, Hybrids, and Packaging was published 1971-1977. The latest title for this publication is IEEE Transactions on Advanced Packaging.
Further Links
IEEE Transactions on Parts, Hybrids, and Packaging was published 1971-1977. The latest title for this publication is IEEE Transactions on Advanced Packaging.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=8217 More »
Frequency: 4
ISSN:
0361-1000
Subjects
- Components, Circuits, Devices & Systems
Author Resources
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Title History
- ( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
- ( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
- ( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
- ( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
- ( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
- ( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
- ( 1963 - 1965 ) Component Parts, IEEE Transactions on
- ( 1955 - 1962 ) Component Parts, IRE Transactions on
- ( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
- ( 1956 - 1959 ) Production Techniques, IRE Transactions on
- ( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on
