Device and Materials Reliability, IEEE Transactions on
IEEE Transactions on Device and Materials Reliability provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture.
Latest Published Articles
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Packaging of Single-Component Fractional Order Element
Mar-07 2013 -
Long-term RF Burn-in Effects on Dielectric Charging of MEMS Capacitive Switches
Mar-07 2013 -
Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
Mar-07 2013 -
Insights in the Physical Damage of
Mar-07 2013 -
Reliability Characteristics of Ferroelectric
Mar-07 2013
Popular Articles
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Review of cooling technologies for computer products
Jan-31 2005 -
A new SPICE reliability simulation method for deep submicrometer CMOS VLSI circuits
Aug-14 2006 -
Review on high-k dielectrics reliability issues
Ribes, G. ; Mitard, J. ; Denais, M. ; Bruyere, S. ; Monsieur, F. ; Parthasarathy, C. ; Vincent, E. ; Ghibaudo, G.Jun-13 2005 -
MEMS Reliability Review
Jun-01 2012 -
Radiation-induced soft errors in advanced semiconductor technologies
Dec-05 2005
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Meet Our Editors
Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.
Electron Devices, IEEE Transactions on
Applied Physics Letters
Electron Device Letters, IEEE
Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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2. A new SPICE reliability simulation method for deep submicrometer CMOS VLSI circuits
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PDF (384 KB)
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3. Review on high-k dielectrics reliability issues
Ribes, G. ; Mitard, J. ; Denais, M. ; Bruyere, S. ; Monsieur, F. ; Parthasarathy, C. ; Vincent, E. ; Ghibaudo, G. |
PDF (864 KB)
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6. Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules
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PDF (940 KB)
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7. Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives
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12. Reliable Inkjet-Printed Interconnections on Foil-Type Li-Ion Batteries
Palacios-Aguilera, N.B. ; Visser, H.A. ; Sridhar, A. ; Balda-Irurzun, U. ; Vargas-Llona, L.D. ; Jiang Zhou ; Akkerman, R. ; French, P.J. ; Bossche, A. |
PDF (771 KB)
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14. Electroluminescence and Transmission Electron Microscopy Characterization of Reverse-Biased AlGaN/GaN Devices
Cullen, D.A. ; Smith, D.J. ; Passaseo, A. ; Tasco, V. ; Stocco, A. ; Meneghini, M. ; Meneghesso, G. ; Zanoni, E. |
PDF (1657 KB)
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17. Modeling of tunneling current and gate dielectric reliability for nonvolatile memory devices
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PDF (816 KB)
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18. Thermally Activated Degradation of Remote Phosphors for Application in LED Lighting
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PDF (712 KB)
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19. TDDB Monitoring and Compensation Circuit Design for Deeply Scaled CMOS Technology
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PDF (379 KB)
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20. Mechanism of Electron Trapping and Characteristics of Traps in HfO2 Gate Stacks
Bersuker, G. ; Sim, J.H. ; Park, Chang Seo ; Young, Chadwin D. ; Nadkarni, S. ; Choi, Rino ; Byoung Hun Lee |
PDF (935 KB)
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21. Comparison of System-Level ESD Design Methodologies—Towards the Efficient and ESD Robust Design of Systems
Scholz, M. ; Shih-Hung Chen ; Vandersteen, G. ; Linten, D. ; Hellings, G. ; Sawada, M. ; Groeseneken, G. |
PDF (460 KB)
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23. Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging
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PDF (940 KB)
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HTMLAims & Scope
IEEE Transactions on Device and Materials Reliability provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture.
Meet Our Editors
Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.
Further Links
IEEE Transactions on Device and Materials Reliability provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture.
Aims & Scope
Provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture. It focuses on the reliability of electronic, optical, and magnetic devices, and microsystems; the materials and processes used in the manufacture of these devices; and the interfaces and surfaces of these materials.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=7298 More »
Frequency: 4
ISSN: 1530-4388
Publication Details: IEEE Transactions on Device and Materials Reliability
Published by:
Subjects
- Components, Circuits, Devices & Systems
- Engineered Materials, Dielectrics & Plasmas
Contacts
Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.
9 Creation Rd 1
Science Based Industrial Park
Hsinchu 300-77 300-77 Taiwan
aoates@tsmc.com
Phone:011 886 3 566 6090
Fax:011 886 3 578 1064
Jo Ann Marsh
IEEE/EDS Publications Office
445 Hoes Lane
Piscataway, NJ 08854 08854 USA
j.marsh@ieee.org
Fax:+1 732-562-6831
About this Journal
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Author Resources
Society Sponsor
Contacts
Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.
