Components and Packaging Technologies, IEEE Transactions on
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Latest Published Articles
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Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation
Dec-30 2010 -
Editorial - Science, Technology, and Industrial Policy
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Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode
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Electrical Contact Resistance in Thin
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Multiobjective Optimization of a Grooved Micro-Channel Heat Sink
Dec-30 2010
Popular Articles
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Dynamic lithium-ion battery model for system simulation
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Power and life extension of battery-ultracapacitor hybrids
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Characterization of hygroscopic swelling behavior of mold compounds and plastic packages
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Printed organic transistors for ultra-low-cost RFID applications
Dec-05 2005 -
Reliability analysis and design for the fine-pitch flip chip BGA packaging
Nov-30 2004
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Meet Our Editors
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
Electronics Packaging Manufacturing, IEEE Transactions on
Sensors Journal, IEEE
Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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3. Characterization of hygroscopic swelling behavior of mold compounds and plastic packages
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11. Contact resistance calculations: generalizations of Greenwood's formula including interface films
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PDF (216 KB)
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12. Closed-loop electroosmotic microchannel cooling system for VLSI circuits
Linan Jiang ; Mikkelsen, J. ; Jae-Mo Koo ; Huber, D. ; Shuhuai Yao ; Zhang, L. ; Zhou, P. ; Maveety, J.G. ; Prasher, R. ; Santiago, J.G. ; Kenny, T.W. ; Goodson, Kenneth E. |
PDF (886 KB)
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14. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Hyoung-Joon Kim ; Joo Yeon Lee ; Kyung-Wook Paik ; Kwang-Won Koh ; Won, J. ; Sihyun Choe ; Jin Lee ; Jung-Tak Moon ; Yong-Jin Park |
PDF (928 KB)
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15. Maximum thermal spreading resistance for rectangular sources and plates with nonunity aspect ratios
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PDF (1459 KB)
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17. Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode
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18. Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging
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PDF (1007 KB)
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19. ESD protection design to overcome internal damage on interface circuits of a CMOS IC with multiple separated power pins
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PDF (1216 KB)
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24. Heat transfer analysis and simplified thermal resistance modeling of linear motor driven stages for SMT applications
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Aims & Scope
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Meet Our Editors
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
Further Links
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Aims & Scope
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=6144 More »
Frequency: 4
ISSN: 1521-3331
Publication Details: IEEE Transactions on Components and Packaging Technologies
Subjects
- Components, Circuits, Devices & Systems
Contacts
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
3501 Ed Bluestein Blvd., TX11/K10
Austin, TX 78721 78721 USA
rama@ieee.org
Phone:+1 512 933 2555
Fax:+1 512 933 6438
Editor-in-Chief
S.W. Ricky Lee
Hong Kong University of Science & Technology
Department of Mechanical Engineering
Clear Water Bay, Kowloon Hong Kong
rickylee@ust.hk
Phone:852 2358 7203
Fax:852 2358 1543
About this Journal
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Title History
- ( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
- ( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
- ( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
- ( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
- ( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
- ( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
- ( 1963 - 1965 ) Component Parts, IEEE Transactions on
- ( 1955 - 1962 ) Component Parts, IRE Transactions on
- ( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
- ( 1956 - 1959 ) Production Techniques, IRE Transactions on
- ( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on
Contacts
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
