Electronics Packaging Manufacturing, IEEE Transactions on
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
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Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire Bonds
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Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems
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Reducing Solder Paste Inspection in Surface-Mount Assembly Through Mahalanobis–Taguchi Analysis
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Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach
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The changing automotive environment: high-temperature electronics
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Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
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Uncertainty estimation by Monte Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization Processes
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Printed circuit board recycling: a state-of-the-art survey
Sep-03 2004
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Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University
Components and Packaging Technologies, IEEE Transactions on
Sensors Journal, IEEE
Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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3. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
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PDF (348 KB)
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4. Uncertainty estimation by Monte Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization Processes
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PDF (576 KB)
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6. Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits
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PDF (3968 KB)
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7. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
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PDF (934 KB)
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8. Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils
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11. Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory
Osenbach, J.W. ; Shook, R.L. ; Vaccaro, B.T. ; Potteiger, B.D. ; Amin, A.N. ; Hooghan, K.N. ; Suratkar, P. ; Ruengsinsub, P. |
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21. Statistical methods for the estimation of process variation effects on circuit operation
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HTMLAims & Scope
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University
Further Links
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Aims & Scope
This journal addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=6104 More »
Frequency: 2
ISSN: 1521-334X
Subjects
- Components, Circuits, Devices & Systems
- Power, Energy, & Industry Applications
Contacts
Editor-in-Chief
R. Wayne Johnson
Auburn University
162 Broun Hall
Auburn, AL 36849 36849 USA
johnson@eng.auburn.edu
Phone:+1 334 844 1880
Fax:+1 334 844 1898
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Title History
- ( 1999 - 2010 ) Electronics Packaging Manufacturing, IEEE Transactions on
- ( 1999 - 2010 ) Components and Packaging Technologies, IEEE Transactions on
- ( 1999 - 2010 ) Advanced Packaging, IEEE Transactions on
Contacts
Editor-in-Chief
R. Wayne Johnson
Auburn University
