Advanced Packaging, IEEE Transactions on
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Latest Published Articles
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A Flexible Time-Stepping Scheme for Hybrid Field-Circuit Simulation Based on the Extended Time-Domain Finite Element Method
Jan-06 2011 -
A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications
Jan-06 2011 -
A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution
Jan-06 2011 -
A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects
Jan-06 2011 -
Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction
Jan-06 2011
Popular Articles
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Packaging of bio-MEMS: strategies, technologies, and applications
Velten, T. ; Ruf, H.H. ; Barrow, D. ; Aspragathos, N. ; Lazarou, P. ; Jung, E. ; Malek, C.K. ; Richter, M. ; Kruckow, J. ; Wackerle, M.Nov-07 2005 -
Waveform Relaxation Time Domain Solver for Subsystem Arrays
Jan-06 2011 -
Design and Characterization of Purely Textile Patch Antennas
Nov-13 2006 -
A solder-free interconnect approach for integrating millimeter wave high-power devices with planar circuitry
Jan-07 2004 -
Recent advances in flip-chip underfill: materials, process, and reliability
Oct-04 2004
Publish in this Journal
Meet Our Editors
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
Related Journals
IEEE Access
Proceedings of the IEEE
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Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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1. Packaging of bio-MEMS: strategies, technologies, and applications
Velten, T. ; Ruf, H.H. ; Barrow, D. ; Aspragathos, N. ; Lazarou, P. ; Jung, E. ; Malek, C.K. ; Richter, M. ; Kruckow, J. ; Wackerle, M.
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4. A solder-free interconnect approach for integrating millimeter wave high-power devices with planar circuitry
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PDF (1961 KB)
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8. Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications
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PDF (1344 KB)
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12. A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures
Lijun Jiang ; Chuan Xu ; Rubin, B.J. ; Weger, A.J. ; Deutsch, A. ; Smith, H. ; Caron, A. ; Banerjee, K.
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14. 160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based Transceivers
Doany, F.E. ; Schow, C.L. ; Baks, C.W. ; Kuchta, D.M. ; Pepeljugoski, P. ; Schares, L. ; Budd, R. ; Libsch, F. ; Dangel, R. ; Horst, F. ; Offrein, B.J. ; Kash, J.A.
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15. Power distribution system design methodology and capacitor selection for modern CMOS technology
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PDF (204 KB)
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16. SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
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PDF (832 KB)
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19. Using self-assembly for the fabrication of nano-scale electronic and photonic devices
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PDF (668 KB)
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20. Stress analysis in silicon die under different types of mechanical loading by finite element method (FEM)
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PDF (525 KB)
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HTMLAims & Scope
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Meet Our Editors
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
Further Links
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Aims & Scope
IEEE Transactions on Advanced Packaging was the number two most-cited journal in manufacturing engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information. This publication has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=6040 More »
Frequency: 4
Subjects
- Aerospace
- Communication, Networking & Broadcasting
- Components, Circuits, Devices & Systems
- Computing & Processing (Hardware/Software)
- Engineered Materials, Dielectrics & Plasmas
- Engineering Profession
- Fields, Waves & Electromagnetics
- General Topics for Engineers (Math, Science & Engineering)
- Photonics & Electro-Optics
- Power, Energy, & Industry Applications
- Signal Processing & Analysis
- Transportation
Contacts
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
585 Purdue Mall
West Lafayette, IN 47907 47907 USA
ganeshs@purdue.edu
Phone:+1 765 494 9770
Fax:+1 765 494 9770
About this Journal
Editorial Board
Content Announcements
Author Resources
Society Sponsor
Title History
- ( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
- ( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
- ( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
- ( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
- ( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
- ( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
- ( 1963 - 1965 ) Component Parts, IEEE Transactions on
- ( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
- ( 1955 - 1962 ) Component Parts, IRE Transactions on
- ( 1956 - 1959 ) Production Techniques, IRE Transactions on
- ( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on
Contacts
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
