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Advanced Packaging, IEEE Transactions on

IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

Aims & Scope

Meet Our Editors

Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering

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