Components, Packaging and Manufacturing Technology, IEEE Transactions on
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.
Latest Published Articles
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Influence on Cooling Performance of Jet Impingement Heat Sink Structures
Apr-29 2013 -
Parallel Circuit Simulation via Binary Link Formulations (PvB)
Apr-29 2013 -
Bonding Silicon Chips to Aluminum Substrates Using Ag–In System Without Flux
Apr-29 2013 -
Low Capacitance Through-Silicon-Vias With Uniform Benzocyclobutene Insulation Layers
Apr-29 2013 -
Endurance of Thin Insulation Polyimide Films for High-Temperature Power Module Applications
Apr-29 2013
Popular Articles
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Substrate-Integrated Waveguide Bandpass Filters With Planar Resonators for System-on-Package
Feb-01 2013 -
Die Attach Materials for High Temperature Applications: A Review
Apr-11 2011 -
Compact Tunable Bandpass Filter With a Fixed Out-of-Band Rejection Based on Hilbert Fractals
Feb-21 2013 -
Compact and Broadband CB-CPW-to-SIW Transition Using Stepped-Impedance Resonator With 90
Feb-01 2013 -
Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization
Feb-01 2013
Publish in this Journal
Meet Our Editors
Managing Editor
R. Wayne Johnson
Auburn University
Related Journals
IEEE Access
Proceedings of the IEEE
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Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
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1. Substrate-Integrated Waveguide Bandpass Filters With Planar Resonators for System-on-Package
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PDF (1935 KB)
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3. Compact Tunable Bandpass Filter With a Fixed Out-of-Band Rejection Based on Hilbert Fractals
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PDF (1512 KB)
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4. Compact and Broadband CB-CPW-to-SIW Transition Using Stepped-Impedance Resonator With 90
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5. Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterization
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PDF (838 KB)
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6. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
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7. 3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections
Khan, N. ; Li Hong Yu ; Tan Siow Pin ; Soon Wee Ho ; Kripesh, V. ; Pinjala, D. ; Lau, J.H. ; Toh Kok Chuan |
PDF (986 KB)
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10. Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
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PDF (1426 KB)
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12. High-Performance, Compact Quasi-Elliptic Band Pass Filters for V-Band High Data Rate Radios
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PDF (762 KB)
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15. Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects
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16. Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Jonghyun Cho ; Eakhwan Song ; Kihyun Yoon ; Jun So Pak ; Joohee Kim ; Woojin Lee ; Taigon Song ; Kiyeong Kim ; Junho Lee ; Hyungdong Lee ; Kunwoo Park ; Seungtaek Yang ; Minsuk Suh ; Kwangyoo Byun ; Joungho Kim
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18. Measurement and Analysis of a High-Speed TSV Channel
Heegon Kim ; Jonghyun Cho ; Myunghoi Kim ; Kiyeong Kim ; Junho Lee ; Hyungdong Lee ; Kunwoo Park ; Kwangseong Choi ; Hyun-Cheol Bae ; Joungho Kim ; Jiseong Kim |
PDF (2420 KB)
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19. Design of Compact Dual-Band Power Dividers With Frequency-Dependent Division Ratios Based on Multisection Coupled Line
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PDF (1192 KB)
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21. Effect of the Thermomechanical Properties of No-Flow Underfill Materials on Interconnect Reliability
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PDF (1414 KB)
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23. Multichip Embedding Technology Using Fine-Pitch Cu–Cu Interconnections
Khan, S.A. ; Choudhury, A. ; Kumbhat, N. ; Pulugurtha, M.R. ; Sundaram, V. ; Meyer-Berg, G. ; Tummala, R. |
PDF (1286 KB)
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24. Complete Modeling of Large Via Constellations in Multilayer Printed Circuit Boards
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PDF (824 KB)
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HTMLAims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.
Meet Our Editors
Managing Editor
R. Wayne Johnson
Auburn University
Further Links
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.
Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=5503870 More »
Frequency: 12
Publication Details:
IEEE Components, Packaging and Manufacturing Technology Society
ISSN:
2156-3950
Subjects
- Aerospace
- Bioengineering
- Communication, Networking & Broadcasting
- Components, Circuits, Devices & Systems
- Computing & Processing (Hardware/Software)
- Engineered Materials, Dielectrics & Plasmas
- Engineering Profession
- Fields, Waves & Electromagnetics
- General Topics for Engineers (Math, Science & Engineering)
- Geoscience
- Nuclear Engineering
- Photonics & Electro-Optics
- Power, Energy, & Industry Applications
- Robotics & Control Systems
- Signal Processing & Analysis
- Transportation
Contacts
Co-Editor
Jose E Schutt-Aíne
Electrical Performance of Integrated Systems
University of Illinois at Urban Champaign
Electrical and Computer Engineering
155 Everitt Laboratory, 1406 W. Green St.
Urbana, IL 61801 USA
jschutt@emlab.uiuc.edu
Phone:+1 217 244 7279
Co-Editor
Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX 78735 USA
rama@ieee.org
Co-Editor
Kuo-Ning Chiang
Packaging Technologies
National Tsing Hua University
Department of Power Mechanical Engineering
No.101, Sec.2, Kuang Fu Road
Hsinchu 300 Taiwan
knchiang@pme.nthu.edu.tw
Phone:886 3 5742925
Co-Editor
R. Wayne Johnson
Electronics Manufacturing
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+ 1 334 844 1880
Co-Editor
Ravi Mahajan
Advanced Packaging
Intel
Pathfinding
5000 W. Chandler Blvd.
Chandler, AZ 85226 USA
ravi.v.mahajan@intel.com
Phone:+1 480 554 3715
Managing Editor
R. Wayne Johnson
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+1 334 844 1880
About this Journal
Editorial Board
Author Resources
Society Sponsor
Title History
- ( 1999 - 2010 ) Electronics Packaging Manufacturing, IEEE Transactions on
- ( 1999 - 2010 ) Components and Packaging Technologies, IEEE Transactions on
- ( 1999 - 2010 ) Advanced Packaging, IEEE Transactions on
Contacts
Managing Editor
R. Wayne Johnson
Auburn University
