Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Latest Published Articles
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An assessment of the electronics industry in Southeast Asia
Aug-06 2002 -
Mechatronics in storage technology
Aug-06 2002 -
Gas flow effects on precision solder self-alignment
Aug-06 2002 -
The development of Taiwan's integrated circuit industry
Aug-06 2002 -
Micromechatronics and the miniaturization of structures, devices, and systems
Aug-06 2002
Popular Articles
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ESD evaluation methods for a charged device model
Aug-06 2002 -
Underfill flow as viscous flow between parallel plates driven by capillary action
Aug-06 2002 -
Design for semiconductor manufacturing. Perspective
Aug-06 2002 -
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Aug-06 2002 -
Novel clamp circuits for IC power supply protection
Aug-06 2002
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Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.-
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4. Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
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PDF (524 KB)
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7. Effective modeling of the reflow soldering process: basis, construction, and operation of a process model
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PDF (208 KB)
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9. Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications
Kuhmann, J.F. ; Preuss, A. ; Adolphi, B. ; Maly, K. ; Wirth, T. ; Oesterle, W. ; Pittroff, W. ; Weyer, G. ; Fanciulli, M. |
PDF (376 KB)
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10. Compression flow modeling of underfill encapsulants for low cost flip-chip assembly
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PDF (1100 KB)
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11. Equipment fault detection using spatial signatures
Gardner, M.M. ; Jye-Chyi Lu ; Gyurcsik, R.S. ; Wortman, J.J. ; Hornung, B.E. ; Heinisch, H.H. ; Rying, E.A. ; Rao, S. ; Davis, J.C. ; Mozumder, P.K. |
PDF (220 KB)
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12. Assembly of planar array components using anisotropic conducting adhesives-a benchmark study: pt.I. Experiment
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PDF (200 KB)
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14. The impact of technology scaling on ESD robustness of aluminum and copper interconnects in advanced semiconductor technologies
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PDF (1592 KB)
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20. Very fast transmission line pulsing of integrated structures and the charged device model
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PDF (264 KB)
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24. Excimer laser projection micromachining of polyimide thin films annealed at different temperatures
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PDF (204 KB)
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Aims & Scope
Further Links
Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=3476 More »
Frequency: 4
ISSN:
1083-4400
Subjects
- Components, Circuits, Devices & Systems
- Power, Energy, & Industry Applications
