Home  |   Login  |   Logout  |   Access Information  |   Alerts  |   Purchase History  |   Cart  |   Sitemap  |   Help   
 
IEEE Transactions
BROWSE SEARCH IEEE XPLORE GUIDE SUPPORT
Components and Packaging Technologies, IEEE Transactions on
  Forthcoming: 
Year: 
Select: 
 
Search This Publication
Submit to Manuscript Central
RSS Feed for Latest Issue:   RSS  » Learn more


Frequency: 2

ISSN: 1521-3331

Subject Category: Accelerator Technology

Published by:  IEEE Components, Packaging, and Manufacturing Technology Society
                         
Visit the Website:  IEEE Transactions on Components and Packaging Technologies

Persistent Link (OPAC):  http://ieeexplore.ieee.org/servlet/opac?punumber=6144    » Learn more

Top Accessed Documents for the Month:  » View
Title History
(1994 - 1998) Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
(1978 - 1993) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(1971 - 1977) Parts, Hybrids, and Packaging, IEEE Transactions on
(1965 - 1971) Parts, Materials and Packaging, IEEE Transactions on
Aims and Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.
Contacts    
     
Editor-in-Chief
S.W. Ricky Lee 
Hong Kong University of Science & Technology
Department of Mechanical Engineering
Clear Water Bay, Kowloon, Hong Kong
Phone: 852 2358 7203
Fax: 852 2358 1543
Email: rickylee@ust.hk  
Editor-in-Chief
Koneru Ramakrishna 
Freescale Semiconductor, Inc.
3501 Ed Bluestein Blvd., TX11/K10
Austin, TX 78721, USA
Phone: +1 512 933 2555
Fax: +1 512 933 6438
Email: rama@ieee.org  


 
Components and Packaging Technologies, IEEE Transactions on
 
Learn more about IEEE Journal & Magazine subscriptions
Indexed by IEE Inspec
© Copyright 2009 IEEE – All Rights Reserved