IEEE Transactions on Advanced Packaging was the number two most-cited journal in manufacturing engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information. This publication has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.