Addresses innovations of interest to the integrated circuit manufacturing researcher and professional. Includes advanced process control, equipment modeling and control, yield analysis and optimization, defect control, and manufacturability improvement. It also addresses factory modelling and simulation, production planning and scheduling, as well as environmental issues in semiconductor manufacturing.
Contacts
Editor-in-Chief
Professor Duane S. Boning
Massachusetts Institute of Technology
Dept. of EE&CS (Rm 39-567B)
Cambridge, MA 02139, USA
Phone: +1 617 253 0931
Fax: +1 617 253 9606
Email: boning@mtl.mit.edu
Cart
