Advanced wet cleaning using novel nozzle and functional ultrapure water in next generation FPD/LSI manufacturing

The advanced wet cleaning method relates to the fluid feed nozzle with ultrasonics that is employed for removing contaminants from the surfaces of the substrates during processes for manufacturing LCD or ULSI. In this method, the pressure among feeding and discharging cleaning solution and ambient air is balanced. This balance causes to feed adequate thickness of cleaning solution to remove particles from the substrate and to discharge waste solution and removed particles. The cleaning solution consumption of this method is less than 1/10 of conventional shower type nozzle with ultrasonic that has been popular in LCD fabrications. We named the nozzle using this method "balanced push-pull nozzle" (BPP-nozzle). The BPP-nozzle with ultrasonics and hydrogen-dissolved ultrapure water can remove PSL particles from above 30000 to about 100 in the Si-wafer cleaning.