Development of low loss organic-micromachined interconnects on silicon at microwave frequencies

We present the design and development of organic micromachined structures on silicon (Si) at microwave/millimeter wave frequencies. The process employs an ultra-thick negative photoresist SU-8 that can be spun-coated and processed using standard lithography techniques. Using this process, we develop micromachined coplanar waveguide (CPW) interconnects on Si substrates. The micromachined grounded-CPW on Si (7.2 /spl Omega/-cm) achieves a measured insertion loss of 0.07 dB/mm and 0. 13 dB/mm at 10 GHz and 20 GHz, respectively.