Residual stresses in the electrode of Pt/Ti for the thermal detector with thin-film structure

Residual stress of Pt/Ti thin film electrode was investigated as a function of substrate temperature by using of XRD and SEM. In order to develop the residual stress, stress sensitive structures of Pt/Ti thin film on SiO/sub 2//Si(substrate) were fabricated. Thermally induced residual stress, which was originated in the different thermal expansion coefficients between film and substrate, was led to the dimensional change of overall structure. XRD results confirmed the existence of internal stresses on Pt/Ti thin film.