A robust model parameter extraction technique based on meta-evolutionary programming for high speed/high frequency package interconnects

A high efficiency version of the evolutionary algorithm called meta-evolutionary programming (meta-EP) is proposed for extraction of the circuit model parameters of the basic structures in the complex high speed/high frequency package interconnects such as flip chip interconnects. The algorithm is integrated with a diversity enhancement method called niching in order to decrease the chance of premature convergence. The method is applied to model parameter extraction of some flip chip interconnects such as coplanar waveguide (CPW) and stripline transitions in multi-layered structures. The results of this parametric modeling in all cases show excellent success with high accuracy in a wide range of frequency up to 50 GHz. Comparison with results, achieved from other techniques in these cases, proves the robustness of the proposed method.