Thermal absorption in surface mount assembly

Thermal phenomena studies in the case of surface mounted devices have two usual directions. Firstly, it is very important to know the thermal dissipation or heat transfer from devices to the user environment, and secondly, it is important to know the thermal absorption or heat transfer from the manufacturing environment to the components and assembly. The first direction offers criteria to fabricate good functional electronic modules. The second direction offers criteria to fabricate electronic modules easily and with low costs. Both directions of study are very important to establish final PCB design, and these methods are called "multicriterial thermal design". In this paper, we try to establish a method to measure the thermal absorption. This information can be used in the reflow soldering process.