Optimization of SMD assembly systems regarding dynamical and thermal behaviors

The increasing miniaturization and complexity of component packages have created a substantial need for quality, flexibility and economy in surface mount devices (SMD) assembly. According to these trends, manufacturing systems have to fulfil high demands concerning productivity and accuracy. To preserve placement preciseness time consuming inspection systems and mapping methods are currently used. The influence of thermal machine behavior and the dynamics on the accuracy is still insufficiently investigated. The aim of this paper is to accomplish decisive contribution for future development and optimization of automatic placement machines, in order to fulfil special demands and to achieve high productivity concurrently with the high accuracy.