Determining the inductance of a through-substrate via using multiple on-wafer test approaches

Four on-wafer measurement approaches for determining the inductance, L/sub via/, of through-substrate vias used in gallium arsenide (GaAs) monolithic microwave integrated circuits (MMICs) have been implemented and compared. All of the approaches yielded similar results, enabling an accurate estimate for L/sub via/. The implementations, advantages, and disadvantages of each approach are compared.