Numerical optimization of a power electronics cooling assembly

This paper focuses on system level design of a fan-driven cooling assembly for power electronics devices. The goal is to achieve a compact fan-sink air-cooling system that can dissipate the targeted power rate within an acceptable temperature rise. Two critical components, the fan and the heatsink, have been chosen for investigation. Considering the time-consuming and expensive design cycle, CFD emerges as a favorable choice in virtual prototyping. A nonlinear optimizer coupled with the response surface by moving least square technique have been adopted to further shorten the design cycle. Substantial improvements to reduce the maximum temperature rise on the base plate of the heatsink have been obtained. The synergistic efforts of CFD and optimization have also accelerated the systematic design process in two months. A fringe benefit during the design process is worth mentioning. A database of design optimization for individual cooling assembly component is also established, which is useful for future reference.