Characterization of advanced materials for high voltage/high temperature power electronics packaging

To achieve high reliability in next generation dense, high voltage (>1 kV DC), high temperature (200/spl deg/C to 400/spl deg/C) power electronic circuits, packaging techniques from higher voltage systems (5 kV-50 kV) need to be introduced. This paper describes advanced materials, measurement and characterization techniques for this class of systems. These systems are being developed for commercial, industrial and military applications that include supplies, drives and actuators. The results are applicable to 1200 V+IGBT based module designs.