Dual Side Molding SiP Drop Reliability Analysis

The package structural System-in-Package (SiP) has been widely applied for many years. A substrate-based platform integrates heterogeneous components such as RF front-end module, WiFi module and passives into one package. The main strategy and advantages of SiP are small form factor, flexible design, low cost and time to market. To reduce module area and increase mounted components, the advanced technology of dual side molding module is developed to integrate effectively both sides of the substrate. However, dual side molding module face the challenge of the board level reliability, especially drop performance. In this work, both experiment and numerical model were investigated to analyze board level drop reliability of the package. The board level drop experiment was followed JEDEC JESD22-B111 with profile 1500G & 0.5ms and analyzed by Weibull method to calculate the solder fatigue life of dual side molding module. Solder joint performance between module and PCB was focused with different dimensions and materials. Moreover, a three-dimension finite element method (FEM) was used to find the stress level comparison and comes out design guideline for solder joints shape study of the dual side molding module under drop test. The preliminary result shows that without laser ablation gets better characteristic life performance. The numerical analysis will correlate with the actual results to the further investigation of dual side module package.