Design of a smart pixel multispectral imaging array using 3D stacked thin film detectors on Si CMOS circuits

We discuss the design of a smart multispectral imaging system which can be fabricated with independently optimized detector arrays and Si CMOS circuits, which are stacked in three dimensions on top of one another for complete physical registration of the multispectral image. This smart multispectral imager utilizes the heterogeneous integration of thin film GaN (UV), MCT (MWIR), and Si CMOS circuitry to create an outstanding example of the power of heterogeneous integration for enhancing optical systems using electronic signal processing capabilities.