Thermal characterization of point of used power supply

A numerical and experimental study of convection heat transfer on a point of used power supply, PUPS, was conducted to determine its thermal performance. The present investigation performed a series of experiments in both free and forced convection modes. The numerical model was also developed to validate the experimental data. The present work also introduced a thermal compact model for the PUPS. This thermal compact model is function of the temperature of the motherboard, ambient temperature, and the thermal resistances between the surface of the PUPS to the air, R/sub sa/ and the surface of the PUPS to the motherboard, R/sub sb/. The thermal resistances of the thermal compact model were derived from the experimental results. In addition, the relationships between the thermal resistances of the PUPS and both Rayleigh and Reynolds numbers were also obtained. Finally, the thermal performance of the PUPS in convective heat transfer was determined. The present methodology of the thermal characterization of the present PUPS can be applied to any PUPS, which is commonly used in telecommunication products.