Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations

Actual political and social trends like electro mobility or renewable energy are challenging the current state of the art production technologies in the electronic sector. New application possibilities combined with strongly increasing requirements are showing the limits of established processes and demand for higher efficiency, a longer endurance and miniaturized design. Therefore, this paper describes a novel approach for 3D-spacial power electronic modules in high temperature applications. By means of thermal coating technologies and pressureless sintering methods, the generation of complex, ceramic-based modules will be discussed.