Recommendations to further improvements of HBM ESD component level test specifications

The goal of this paper is to provide data and discussion to help the ESD testing community come to a single and improved HBM ESD component level testing standard. The differences in the ESD Association and the JEDEC HBM testing procedures (/spl sim/qualification) and tester specifications (/spl sim/test result reproducibility) are investigated. A reduction of the test time-and thus cost-by a factor of 30 to ultimately 300, is addressed and justified. A future issue, the definition of HBM waveform envelopes to replace HBM waveform specifications, is addressed and a viable solution is offered.