Applying polymer process studies using molecular modeling

Although process studies are usually done experimentally within the microelectronics board and packaging industry, at Honeywell we have been concerned about facilitating such studies though use of molecular-scale simulation support. For instance, we have used bleed modeling for several years now to understand and target bleed modification additives and to help us predict the effect of both organic and inorganic components on underfill flow. In a similar strategy we have used an adhesion modeling extension to understand stress cycling reliability, and to predict the relative ability of our formulations to withstand thermal cycling. Most recently we have used thermal cycling to help us understand process differences in several resin coated copper foils used in circuit board manufacture. All of these studies have demonstrated usefulness in understanding specific interfacial mechanisms that could not be understood from larger scale simulations or experimental evidence alone. As these studies encompass aspects of both the pre-cure and post-cure state of the adhesive, they require different assumption bases as well as different methodologies to address the performance issues. In this paper we will discuss the strategies applied, their results in in-house formulation and the impacts of using the molecular perspective to increase adhesive understanding in a development scenario.