Tape ball grid array package analysis

As increasing numbers of complex functions are integrated into individual die, the number of I/O increases as well as the requirements for better electrical and thermal performance. Various forms of tape ball grid army (TBGA) packages have been developed to satisfy these requirements in a more cost effective manner. A single metal layer TBGA is adequate in many applications with lower cost. For the higher speed applications in which a separate ground plan is required, the natural tendency is to utilize a two metal layer TBGA. This paper describes how high performance polyimide (PI) tape based materials are being utilized to increase routing density and improve the electrical and thermal performance. The paper also compares one metal layer and two metal layer TBGA from manufacturing process, cost, performance, and infrastructure, etc.