Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions

This paper demonstrates seamless antenna-to-transceiver signal transitions on panel-scale processed ultra-thin glass-based 5G modules with impedance-matched transmission lines and microvias with high-precision low-loss re-distribution layer design and fabrication, for high-speed 5G communication standards at the 28 GHz band. In order to demonstrate the benefits of glass for 5G communications, various types of transmission lines and high-gain and high-bandwidth package-integrated antennas were modeled and designed on ultra-thin glass substrates with low-loss dielectric thin-films, for highest bandwidth and efficiency in the mm-wave bands. The simulated results for insertion losses of transmission lines (i.e., microstrip lines and striplines) and microvia transitions are correlated with the measured values on the thin glass substrates. In addition to the low-loss signal transitions from chip to antenna, package-integrated Yagi-Uda antennas are modeled and designed, resulting in a realized gain of higher than 4 dBi/element with a bandwidth higher than 20%. The mm-wave electrical performance of glass substrates was benchmarked with existing 5G candidates such as organic laminate substrates and fanout wafer level packaging. Along with the reduction in the overall package foot-print, reduction in link-budget losses is shown to be feasible with the proposed 3D glass packages.