Fundamental study on electrically-induced bubble catalytic plating technology

We have succeeded in metallization by embedding metal on the flexible polymer substrate such as PDMS. Novel points of this technology are shown as follows. 1. It eliminates complicated pretreatment processes on the substrate surface before plating, so it is less expensive than electroless plating. 2. Plating resolution in micro-meter order can be achieved with low cost. 3. It is possible to perform local and precise metallization on a wide range of materials without using specialized techniques such as photolithography.