Dispensing challenges of large format packaging and some of its possible solutions

This paper will review the challenges on dispensing liquid encapsulant on large format substrate for compression encapsulation with respect to tailing, dripping, spillage, air trap and highly viscous liquid encapsulant during dispensing. However, these challenges are not insurmountable, it can be overcome technically. The engineering solutions proposed here are applicable to package formats such as Ø 8” to 12” wafer (glass and/or silicon) and a quad panel ranges from SQ 300 (300 × 300mm) to SQ 340 (340 × 340mm). Our proposed technical solutions are a combination of design and processes optimization.