Thermal fatigue life analysis of defective solder joints based on engelmaier fatigue model

Voids in solder joints are considered to be one of the major defects in electronics assembly. And it's very important to screen out unqualified solder joints. However, the existing criteria for void defect screening depend on experience. Our work introduced here is to study the relationship between the thermal fatigue life of the solder joint and the void size. This paper focused on the effect of different size defective solder joints on electronic product life. And this research choose Engelmaier model, a strain-range-based fatigue model, to study the fatigue life of defective solder joints. The required solder joint strain in the Engelmaier model is obtained by the simulation carried out in this paper.