Advanced packaging with greater simplicity

Integrated Fan-Out (InFO) is developed with greater simplicity, based on subtraction in structure, process flow and supply chain management than industry proposed solutions. It achieved un-precedent results compared to others using “additional” structure for functional or yield enhancement. The results include electrical performance, power consumption, thermal resistance, form factor/thickness and cost effectiveness. Greater simplicity continues play critical role for advanced packaging to achieve system PPAC goals.