New desmear process of organic substrate applications by Photodesmear technology

Semi Additive process is considered to dry processing for the miniaturization of the semiconductor packages. There are many problems in the manufacturing substrate of print circuit board, at the materials, tools, processes, conditions etc. Wet process depends on the chemical reaction. That will reach a limit on the precision in the future. Dry process is a concept by semiconductor manufacturing process. But it is difficult to apply for print circuit board manufacturing process. Smear removal from via bottom and forming of surface roughness becomes the trade-off in the high end substrate production. We have been conducted of the research and development of Photodesmear process as next generation process. Photodesmear is the technology that put decomposing organic matter by vacuum ultra violet light and removal inorganic matter by ultrasonic treatment together. The removal of smear on via bottom is controllable by quantity of the vacuum ultra violet light. In addition, Photodesmear can to divide a reaction of the smear removal and the roughness formation. We show our results of the improvement of adhesion between epoxy resin and copper by Photodesmear and dry seed process. Integrated dry process is combined Photodesmear and sputter technologies for a view of panel level package process in the future. In addition, it has much possibility about the application to other processes. Integrated dry process provides many solutions of the next generation of semi additive process.