Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method

To evaluate the impact reliability of solder bumps generated by an induction heating method, the high shear rate impact test was performed on Sn-3.0Ag-0.5Cu/Cu solder bumps soldered by induction heating, and the morphology and thickness of the intermetallic compound (IMC) layer at the interface were examined. The effect of isothermal aging on the impact strength of these solder bumps was investigated, and the fracture surfaces were observed. Compared with the conventional reflow method, a thinner interfacial IMC layer was formed just after soldering by induction heating. The impact strength of Sn-3.0Ag-0.5Cu/Cu solder bumps soldered by induction heating was superior to that of solder bumps soldered by the reflow method.