The cost-effective integration of radiating elements into an X-band multipack

A simple, cost effective, lightweight, and fully integrated AESA Multipack (Multichannel T/R-Module) has been developed by using a standard multilayer RF PCB. The design includes Radiating Elements, T/R-Modules and RF distribution networks on one single PCB. The structures have been concentrated, such that the Multipack comprises a highly integrated topology. The production costs are kept significantly low through the exclusive use of surface mounted technology (SMT) components, all of which are fully capable of automated placement. Due to the use of “standard” PCB materials and the chosen layer arrangements, the design is extremely robust against mechanical stresses and achieves the specified RF results.