Supercooling during the crystallization of in and Sn in copper and molybdenum based multilayer films

Supercooling was studied while crystallizing tin and indium placed between layers of copper or molybdenum by in situ electrical resistance measuring method. It was shown that Cu/In and Cu/Sn films heating is accompanied by homogenization of multilayer films microstructure and by the formation of alloys and chemical compounds. A series of irregular and irreversible features, which are observed on the graphs of the films resistance temperature dependence, simultaneously occurs with the above-mentioned processes. These processes also lead to the decrease in the amount of free tin or indium in the system. The study of supercooling during the crystallization of a low-melting component is rather complex objective, but, at the same time, it opens the possibility to other processes investigation.