Interconnection parasitic effects on optical communication circuit performances

The influence of parasitic elements such as wire bonding and ribbon connections on laser driver performances is analysed. In order to minimize parasitic effects, an interconnection geometry is suggested for a best module response. A simplified method based on the partial element equivalent circuit (PEEC) has been established to model and characterize the inductance of these parasitic elements. Analytical formulas easy to use in CAD applications are derived from the numerical results using the least square method.