Effects of process variation on radiation-induced edge leakage currents in n-channel MOSFETs

The effects of radiation-induced defects and statistical variation in the dose and energy of MOSFET channel implants in a modern bulk CMOS technology are modeled using a process simulator in combination with analytical computations. The model integrates doping profiles obtained from process simulations and experimentally determined defect potentials into implicit surface potential equations. Solutions to these equations are used to model radiation-induced edge leakage currents in n-channel MOSFETs. The results indicate that slight variations in the channel implant parameters can have a significant impact on the doping profile along the STI sidewall and thus the radiation-induced edge leakage currents.