Practical use of CMP process monitor in Cu polishing

We have developed a chemical mechanical polishing (CMP) process monitor which uses polishing vibration. The monitor enables us to accurately detect the polishing end point in copper (Cu) polishing, even when the conditions such as initial film thickness, slurry flow rate and polish rate are changed and when polishing multi-layered films. The processes and equipment can also be controlled as the monitor can detect abnormalities in the polishing conditions.