Three dimensional computerized tomography X-ray technique for package level analysis

3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC devices. It has become a very useful and effective technique for detecting package related failures without going through the lengthy physical analysis with potential of destroying the physical evidences. In this paper, we will present several case studies to show the usefulness of the 3D X-ray imaging for effectively solving real-life issues in failure analysis.